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Capability

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No. Parameters Capability (Standard)
1. Base Material FR2, FR4, CEM1, CEM3, High Tg material & Metal Cladded
2. Board Thickness 12 to 125 mils (0.30 to 3.2 mm]
3. Minimum / Maximum Copper Thickness 0.5 oz (18 microns] / 6.0 oz (210 microns)
4. Minimum core Thickness [ML] 12 mils (0.3 mm]
5. Minimum Line Width & Spacing 4/4 mils [0.12/0.12 mm]
6. Cu. Thick/ Line Width / spacing 1 oz with 4 mils width / 4 mils spacing
2 oz with 8 mils width / 8 mils spacing
3 oz with 12 mils width / 12 mils spacing
4 oz with 14 mils width / 14 mils spacing
7. Minimum finished Hole Dia 12 mils (0.3 mm]
8. Minimum SMD Pitch 20 mils (0.5 mm]
9. Minimum SMD Length 65 mils
10. Minimum SMD Width 10 mils
11. l/L Isolation 20 mils (0.5 mm]
12. Minimum Annular ring l/L 10 mils
13. Minimum Annular ring 0/L 10 mils
14. Maximum PCB / Array size Single & Double 18" x 24"
Multilayer 18" x 15"
15. Minimum line width (silk) 8 mils
16. Carbon Contact Resistance < 500 Ohms Standard
17. Solder Mask LPI / Spray Coating
18. Minimum Solder Dam Width 6 mils
19. Minimum Scoring Width 16 mils (0.4 mm]
20. Minimum Scoring Web 12 mils (0.3 mm]
21. Minimum Npth Slot Width 31 mils (0.8 mm]
22. FTH Hole Tolerance +/- 3 mi's
23. NPT Hole Tolerance +/- 2 mils
24. Routing Tolerance +/- 5 mils
25. Minimum Epoxy Space in Hatch pattern 8 mils
26. Aspect Ratio 06:01

Any specific requirements are subject to our confirmation.

Available Finishes

  • Standard: Hot Air Solder Leveling.
  • ROHS: Lead-free HASL, OSP, Eletroless Nickle & Immersion Gold Plating, Electrolytic Nickle & Gold Plating, Polymer thick circuits with Silver and Carbon, Peelable Solder Mask, Carbon Ink, Silver Ink.

Zero Defect Quality

FCC's objective is to deliver zero defect products built to customer specifications

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Capacity & Capability

  • Installed Capacity
  • Expansion Provision
  • Volume

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