Capability
| No. | Parameters | Capability (Standard) |
| 1. | Base Material | FR2, FR4, CEM1, CEM3, High Tg material, PTFE & Metal Cladded |
| 2. | Board Thickness | 12 to 125 mils (0.30 to 3.2 mm] |
| 3. | Minimum / Maximum Copper Thickness | 0.5 oz (18 microns] / 6.0 oz (210 microns) |
| 4. | Minimum core Thickness [ML] | 12 mils (0.3 mm] |
| 5. | Minimum Line Width & Spacing | 4/4 mils [0.12/0.12 mm] |
| 6. | Cu. Thick/ Line Width / spacing | 1 oz with 4 mils width / 4 mils spacing 2 oz with 8 mils width / 8 mils spacing 3 oz with 12 mils width / 12 mils spacing 4 oz with 14 mils width / 14 mils spacing |
| 7. | Minimum finished Hole Dia | 12 mils (0.3 mm] |
| 8. | Minimum SMD Pitch | 20 mils (0.5 mm] |
| 9. | Minimum SMD Length | 65 mils |
| 10. | Minimum SMD Width | 10 mils |
| 11. | l/L Isolation | 20 mils (0.5 mm] |
| 12. | Minimum Annular ring l/L | 10 mils |
| 13. | Minimum Annular ring 0/L | 10 mils |
| 14. | Maximum PCB / Array size | Single & Double 18" x 24" Multilayer 18" x 15" |
| 15. | Minimum line width (silk) | 8 mils |
| 16. | Carbon Contact Resistance | < 500 Ohms Standard |
| 17. | Solder Mask | LPI / Spray Coating |
| 18. | Minimum Solder Dam Width | 6 mils |
| 19. | Minimum Scoring Width | 16 mils (0.4 mm] |
| 20. | Minimum Scoring Web | 12 mils (0.3 mm] |
| 21. | Minimum Npth Slot Width | 31 mils (0.8 mm] |
| 22. | FTH Hole Tolerance | +/- 3 mi's |
| 23. | NPT Hole Tolerance | +/- 2 mils |
| 24. | Routing Tolerance | +/- 5 mils |
| 25. | Minimum Epoxy Space in Hatch pattern | 8 mils |
| 26. | Aspect Ratio | 06:01 |
Any specific requirements are subject to our confirmation.
Available Finishes
- Standard: Hot Air Solder Leveling.
- ROHS: Lead-free HASL, OSP, Eletroless Nickle & Immersion Gold Plating, Electrolytic Nickle & Gold Plating, Immersion Tin, Peelable Solder Mask, Carbon Ink, Silver Ink.
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