Fineline Circuit Company
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  • Capacity
  • Capabilities
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Capability

No. Parameters Capability (Standard)
1. Base Material FR2, FR4, CEM1, CEM3, High Tg material, PTFE & Metal Cladded
2. Board Thickness 12 to 125 mils (0.30 to 3.2 mm]
3. Minimum / Maximum Copper Thickness 0.5 oz (18 microns] / 6.0 oz (210 microns)
4. Minimum core Thickness [ML] 12 mils (0.3 mm]
5. Minimum Line Width & Spacing 4/4 mils [0.12/0.12 mm]
6. Cu. Thick/ Line Width / spacing 1 oz with 4 mils width / 4 mils spacing
2 oz with 8 mils width / 8 mils spacing
3 oz with 12 mils width / 12 mils spacing
4 oz with 14 mils width / 14 mils spacing
7. Minimum finished Hole Dia 12 mils (0.3 mm]
8. Minimum SMD Pitch 20 mils (0.5 mm]
9. Minimum SMD Length 65 mils
10. Minimum SMD Width 10 mils
11. l/L Isolation 20 mils (0.5 mm]
12. Minimum Annular ring l/L 10 mils
13. Minimum Annular ring 0/L 10 mils
14. Maximum PCB / Array size Single & Double 18" x 24"
Multilayer 18" x 15"
15. Minimum line width (silk) 8 mils
16. Carbon Contact Resistance < 500 Ohms Standard
17. Solder Mask LPI / Spray Coating
18. Minimum Solder Dam Width 6 mils
19. Minimum Scoring Width 16 mils (0.4 mm]
20. Minimum Scoring Web 12 mils (0.3 mm]
21. Minimum Npth Slot Width 31 mils (0.8 mm]
22. FTH Hole Tolerance +/- 3 mi's
23. NPT Hole Tolerance +/- 2 mils
24. Routing Tolerance +/- 5 mils
25. Minimum Epoxy Space in Hatch pattern 8 mils
26. Aspect Ratio 06:01

Any specific requirements are subject to our confirmation.

Available Finishes

  • Standard: Hot Air Solder Leveling.
  • ROHS: Lead-free HASL, OSP, Eletroless Nickle & Immersion Gold Plating, Electrolytic Nickle & Gold Plating, Immersion Tin, Peelable Solder Mask, Carbon Ink, Silver Ink.

Zero Defect Quality

FCC's objective is to deliver zero defect products built to customer specifications

Read More

Capacity & Capability

  • Installed Capacity
  • Expansion Provision
  • Volume

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